A recently translated interview has disclosed that Sony will be providing updates on the PlayStation 5’s cooling fan even after launch, according to game-specific player information. This revelation is yet another example of Sony being quick to react to the criticisms that the PlayStation 4 received for its loud fan noise and cooling system and it’s nothing short of extraordinary.
Specifically, on the older PlayStation 4 systems, the internal cooling fans became infamous for being too hot and loud they could be when the console is running more resource-demanding titles, sometimes even overheating the console as a result.
PlayStation guaranteed they were aware of the problems and spent quite a bit of money and time to make sure the upcoming PlayStation 5 would not have the same cooling problems.
During the weekend, 4gamer talked with Sony’s VP of Mechanical Design Yasuhiro Ootori – who became popular because of his teardown video of the PlayStation 5 = in an interview that has been transcribed by ResetEra user orzkare. Ootori was questioned about several various technical elements of the PlayStation 5, namely the system’s massive fan and proprietary liquid metal cooling system.
VP Ootori revealed that:
“PS5 has three temperature sensors on the mainboard to control the fan speed based on the internal temperature of the APU [Accelerated Processing Unit] and the highest temperature of the three temperature sensors.” Explaining the value of that data, Ootori says, “Various games will be released in the future, and data on the APU’s behavior in each game will be collected. We have a plan to optimize the fan control based on this data.”
The interview revealed just how deeply rooted the problem of the PlayStation 5’s cooling system was in its design. Ootori spoke in detail about the problems they faced in designing the next-gen console in a way that it could cautiously keep itself cool:
“We have wanted to use liquid metal for a long time. However, since liquid metal is conductive, if it leaks to the board side, it will cause a short circuit. Above all, liquid metal is highly corrosive to aluminum, which is used for components such as heat sinks. When handling such materials, measures are required for manufacturing facilities. We spent more than two years preparing for these problems… The main reason is cost. In thermal design, you have to put the cost close to the heat source. As a general thermal design metaphor, let’s say you spend 10 yen for a TIM [Thermal Interface Material] and 1,000 yen for a heat sink in the cooling structure of a certain system. If you change to a 100 yen TIM, you can get the same cooling effect with a 500 yen heat sink. In other words, you can reduce the total cost.”
Juggling cost, safety, and performance have proven to be a daunting task for the development team at PlayStation, but it seems that they are doing the best they can to achieve perfect harmony. Not to mention the news that performance details will be collected, and utilized to improve the PlayStation 5’s fans as necessary.
As critics put it, the PlayStation 5 producer can apparently turn the fans down relying upon how the bulk of games perform or even increase the fan speed if the console begins overheating under specific conditions.
PlayStation will be going to bet on its massive collection of first-party games to help promote the PlayStation 5 to the next generation, so generally, they would be doing the best they can to ensure that those games perform impressively.
Adjusting the performance of the PlayStation 5’s fans even after its release is certain to cut down on the same heating problems the PlayStation 4 has faced, although it is probable that the next-gen console’s fans may still become as loud as the PlayStation 4 that has yet to be seen.